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Sputtering Targets A-E
We offer pure elements, compounds, alloys, ceramics, intermetallics, and mixtures with high purities and quality for R&D and Production applications. Products are widely used in electronics, semiconductor, flat panel display, magneto-optical recording medium, solar photovoltaic and functional coating etc.
We also provide in-house sputter target bonding services by either standard and custom backing plate or copper foil bonding.
If the materials you are seeking are not listed, please email us your requirements as custom projects are our specialty.
Target Name Purity
Ag 99.99%
Al 99.999%
AlCu 99.99%
AlSi 99.99%
Al2O3 99.95%
Al2S3 99.95%
AlN 99.99%
AlSi 99.99%
As2Se3 99.95%
As2Te3 99.95%
Au 99.99%
AuGe 99.99%
AuPd 99.99%
AuSn 99.99%
AZO 99.95%
B 99.9%
B4C 99.95%
Ba 99.9%
BaO 99.99%
BaSrTiO 99.95%
BaTiO3 99.95%
Bi 99.99%
Bi2O3 99.99%
Bi4Ti3O12 99.95%
BiFeO3 99.99%
Bi2Se3 99.95%
BiVO4 99.95%
BN 99.95%
C 99.999%
Ca 99.95%
CaF2 99.99%
CaHfO3 99.95%
CaO 99.99%
Cd 99.99%
Cd2SnO4 99.99%
CdO 99.99%
CdS 99.95%
CdSn 99.95%
CdTe 99.95%
Ce 99.95%
CeO2 99.99%
Co 99.95%
CoNi 99.99%
Co2Fe 99.95%
Co3O4 99.99%
CoCrHf 99.95%
CoCrPt 99.95%
CoFe 99.95%
CoFe2O4 99.99%
CoFeB 99.99%
CoFeO4 99.95%
CoPt 99.95%
CoTaZr 99.95%
CoTb 99.95%
Cr 99.95%
Cr2N 99.95%
Cr2O3 99.99%
Cr3C2 99.95%
CrO3 99.95%
CrSi2 99.95%
Cu 99.99%
Cu2O 99.99%
Cu2S 99.99%
Cu2ZnSnS4 99.95%
CuGa 99.99%
CuO 99.99%
CuO2 99.95%
Dy2O3 99.99%
Er 99.95%
Er2O3 99.99%
Eu 99.99%
Eu2O3 99.95%
Bonding is recommended for ceramic materials. Many ceramic materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. A low thermal conductive target is susceptible to thermal shock and target crack may occur during sputtering process. Bonded targets can usually continue to be used even after a target crack occurs. Besides, the bonded ceramic targets can be cooled more efficiently as thinner target can transfer heat faster to the copper backing plate for heat dissipation. Usually, the thickness of the target is reduced to half when it is bonded to a backing plate and the copper backing plate comprises the other half of the thickness.
Need help?
Contact an Material Specialist by sending an Email to PTL or call 852-98814818.
Download Sputtering Targets Leaflet
Sputtering Targets F-L
Sputtering Targets M-R
Sputtering Targets S-Z
 
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