Sputtering Targets F-L
We offer pure elements, compounds, alloys, ceramics, intermetallics, and mixtures with high purities and quality for R&D and Production applications. Products are widely used in electronics, semiconductor, flat panel display, magneto-optical recording medium, solar photovoltaic and functional coating etc.
We also provide in-house sputter target bonding services by either standard and custom backing plate or copper foil bonding.
If the materials you are seeking are not listed, please email us your requirements as custom projects are our specialty.
Target Name Purity
Bonding is recommended for ceramic materials. Many ceramic materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. A low thermal conductive target is susceptible to thermal shock and target crack may occur during sputtering process. Bonded targets can usually continue to be used even after a target crack occurs. Besides, the bonded ceramic targets can be cooled more efficiently as thinner target can transfer heat faster to the copper backing plate for heat dissipation. Usually, the thickness of the target is reduced to half when it is bonded to a backing plate and the copper backing plate comprises the other half of the thickness.
Contact an Material Specialist by sending an Email to PTL or call 852-98814818.
Download Sputtering Targets Leaflet
Sputtering Targets A-E
Sputtering Targets M-R
Sputtering Targets S-Z